Professional 4 to 40 layer multilayer PCB fabrication with blind/buried vias, impedance control, and sequential lamination. From quick-turn prototypes to high-volume production.
Topfast specializes in high-layer-count multilayer PCBs for advanced electronics. Our sequential lamination and laser drilling capabilities handle the most demanding designs.
Standard multilayer
Common in consumer
Communications
Computing & GPU
Advanced servers
Complex via structures connecting inner layers without penetrating the full board. Essential for high-density designs and maintaining signal integrity in multilayer stacks.
Precise 50Ω, 90Ω, and custom impedance control with ±5% tolerance. Critical for high-speed digital, RF, and DDR memory applications.
Multi-press lamination cycles for complex stack-ups. Handles hybrid constructions with mixed materials including high-frequency Rogers laminates.
Inner layer copper weights from 1oz to 5oz for power distribution layers. Dedicated power planes with thermal relief patterns and thermal vias.
Inner layer cores
Multi-press bonding
Mechanical + laser
Via copper fill
E-test & AOI
4 to 40 layers
0.4mm - 5.0mm
3mil / 3mil
0.1mm (LID)
0.15mm (mech)
±5% tolerance
1/2 - 5 oz inner
Up to 20:1
| Parameter | Standard | Advanced | Premium |
|---|---|---|---|
| Layer Count | 4-8 layers | 10-20 layers | 22-40 layers |
| Min Line/Space | 5mil/5mil | 4mil/4mil | 3mil/3mil |
| Min Laser Via | 0.15mm | 0.1mm | 0.1mm |
| Impedance Tolerance | ±10% | ±7% | ±5% |
| Max Board Size | 500×400mm | 400×300mm | 350×250mm |
| Base Material | FR-4 TG135 | FR-4 TG150 | High-Tg FR-4 / Rogers |