Engineered for signal integrity at high data rates. Advanced low-loss materials and precise impedance control for servers, storage systems, and network equipment operating at 5G+ speeds.
Our high-speed PCB manufacturing uses premium low-Dk/Df materials and tight impedance tolerances to ensure clean, reliable signal transmission at data rates from 10Gbps to 112Gbps+.
Expert stack-up design with controlled impedance for differential pairs (90Ω, 100Ω), single-ended lines (50Ω), and RF trace routing to minimize insertion loss and crosstalk.
Tight tolerance impedance control within ±5% across the panel. TDR testing available for critical high-speed channels to verify impedance consistency.
Customized multi-layer stack-up designs with prepreg spreading control, ensuring consistent dielectric thickness and uniform cross-section for uniform impedance.
Megtron 6/7, Rogers 4000/3000, Isola I-Tera, and Panasonic Megtron materials for minimal signal attenuation at high frequencies.
Laser/microvia back-drilling eliminates stubs on through-vias, maintaining signal integrity at high speeds. Available up to 32 layers.
Time-Domain Reflectometry (TDR) testing, S-parameter measurement, and 100% electrical testing to guarantee high-speed channel performance.
Meeting the most demanding high-speed digital and RF application requirements.
| Parameter | Standard | Advanced | Premium |
|---|---|---|---|
| Data Rate | Up to 28 Gbps | Up to 56 Gbps | Up to 112+ Gbps |
| Materials | FR-4, IT-180A | Megtron 6, Isola I-Tera | Rogers 4003C, Megtron 7 |
| Dielectric Constant (Dk) | 4.2 @ 1GHz | 3.6 @ 10GHz | 3.38 @ 10GHz |
| Loss Tangent (Df) | 0.020 @ 1GHz | 0.004 @ 10GHz | 0.003 @ 10GHz |
| Impedance Tolerance | ±10% | ±7% | ±5% |
| Layer Count | 4-12 layers | 6-20 layers | 8-32 layers |
| Min Line Width/Spacing | 4/4 mil | 3/3 mil | 2.5/2.5 mil |
| Via Types | Through-hole | Blind/Buried | Any-layer HDI, Back-drill |
We source from world's leading laminate manufacturers to ensure consistent performance and reliability.
Ultra-low loss, 112Gbps+
Low loss, 56Gbps
Low Dk, RF/microwave
Wideband RF
Low-loss digital
Mid-loss, 25Gbps+
High-speed digital
Cost-effective low-loss
PCIe 5.0/6.0, memory modules, switch cards, and backbone routers operating at extreme data rates.
NVMe SSD controllers, RAID controllers, and high-speed storage interconnects (32Gbps+).
Switches, routers, optical transceivers, and 5G base station RF front-end modules.
mmWave antenna modules, beamforming circuits, and high-speed backhaul infrastructure.
ADAS control units, automotive Ethernet (100BASE-T1, 1000BASE-T1), and infotainment systems.
High-speed data acquisition boards for CT scanners, MRI machines, and ultrasound systems.
Signal integrity engineers review stack-up, trace routing, and impedance requirements.
Select optimal low-loss materials based on target data rate and application environment.
Precision lamination, controlled impedance etching, and laser direct imaging for fine traces.
TDR impedance verification, electrical test, and microsection analysis of impedance coupons.