Expert-level fine-pitch assembly for BGA, QFN, LGA, CSP, and DIP packages. X-ray inspection and thermal profiling for reliable solder joints.
We specialize in fine-pitch and advanced packaging assemblies with precision placement, rigorous inspection, and controlled reflow profiling.
Ball Grid Array packages from 0.5mm to 2.0mm pitch. Full X-ray inspection of solder joints beneath the package for void and connection quality.
Quad Flat No-lead and Land Grid Array with bottom-side terminations. Precise paste printing and reflow profiling for reliable thermal pad connections.
Dual in-line packages and through-hole devices. Wave soldering and selective soldering with precise lead cutting and clinching.
Chip Scale Packages and Wafer Level CSP with ultra-fine pitch down to 0.25mm. Advanced flux application and ultra-low impact placement.
Custom reflow oven profiles for each package type. K-type thermocouples, peak temp monitoring, and soak time optimization for void-free joints.
2D and 3D X-ray for BGA/QFN solder joint integrity. Automated Optical Inspection for cosmetic defects on all package types.
Laser-cut SS stencil
0.1mm paste deposition
5μm placement accuracy
Optimized thermal profile
Hidden joint inspection
ICT or functional test
Wide coverage of advanced packaging types from standard DIP to cutting-edge BGA and WLCSP.
0.5mm – 2.0mm pitch, 4×4 to 50×50mm body, standard & reverse pitch options
0.4mm – 0.65mm pitch, 3×3 to 10×10mm body, exposed thermal pad support
0.4mm – 1.27mm pitch, bottom contact grid array with socket or direct solder
0.25mm – 0.5mm pitch, wafer-level chip scale with underfill option
0.1″ – 0.3″ pin spacing, through-hole with wave or hand soldering
Small outline and thin small outline packages for memory and controllers