Expert-level fine-pitch assembly for BGA, QFN, LGA, CSP, and DIP packages. X-ray inspection and thermal profiling for reliable solder joints.
We specialize in fine-pitch and advanced packaging assemblies with precision placement, rigorous inspection, and controlled reflow profiling.
Ball Grid Array packages from 0.5mm to 2.0mm pitch. Full X-ray inspection of solder joints beneath the package for void and connection quality.
Quad Flat No-lead and Land Grid Array with bottom-side terminations. Precise paste printing and reflow profiling for reliable thermal pad connections.
Dual in-line packages and through-hole devices. Wave soldering and selective soldering with precise lead cutting and clinching.
Chip Scale Packages and Wafer Level CSP with ultra-fine pitch down to 0.25mm. Advanced flux application and ultra-low impact placement.
Custom reflow oven profiles for each package type. K-type thermocouples, peak temp monitoring, and soak time optimization for void-free joints.
2D and 3D X-ray for BGA/QFN solder joint integrity. Automated Optical Inspection for cosmetic defects on all package types.
Laser-cut SS stencil
0.1mm paste deposition
5μm placement accuracy
Optimized thermal profile
Hidden joint inspection
ICT or functional test
Wide coverage of advanced packaging types from standard DIP to cutting-edge BGA and WLCSP.
0.5mm – 2.0mm pitch, 4×4 to 50×50mm body, standard & reverse pitch options
0.4mm – 0.65mm pitch, 3×3 to 10×10mm body, exposed thermal pad support
0.4mm – 1.27mm pitch, bottom contact grid array with socket or direct solder
0.25mm – 0.5mm pitch, wafer-level chip scale with underfill option
0.1″ – 0.3″ pin spacing, through-hole with wave or hand soldering
Small outline and thin small outline packages for memory and controllers
Share your Gerber files, BOM, and assembly drawing. Our engineering team will review pitch requirements and confirm feasibility within 24 hours.
Start Your Quote →