Precision-controlled impedance for high-speed digital, RF, and mixed-signal designs. Achieve ±5% tolerance on single-ended and differential pairs with our advanced stack-up engineering.
As signal speeds increase, controlled impedance becomes critical to prevent reflections, crosstalk, and signal degradation that can cause system failures.
Controlled 50Ω traces for RF signals, clock lines, and single-ended interfaces. Precise trace width calculation based on stack-up geometry and material properties.
100Ω differential impedance for high-speed serial interfaces: PCIe, USB 3.x, SATA, HDMI, DDR4/5, and Ethernet. Tight coupling with controlled intra-pair skew.
Industry-leading ±5% impedance tolerance achieved through precise copper thickness control, consistent dielectric properties, and tight trace width accuracy.
Our impedance-controlled boards are manufactured with precision equipment and verified with TDR testing.
Every impedance-controlled board receives careful stack-up design and verification.
Advanced 2D/3D field solver simulation to predict impedance before fabrication. We optimize layer thickness, trace geometry, and material selection for your target impedance.
Consistent dielectric constant (Dk) and dissipation factor (Df) from premium material suppliers. Material certification and lot tracking for reproducible results.
Laser direct imaging (LDI) for ±0.025mm trace width accuracy. Controlled copper plating thickness ensures consistent impedance across the entire panel.
100% TDR testing on impedance test coupons. Full test report with impedance profiles, rise time, and reflection analysis included with every order.
Free impedance calculation and stack-up review. Our engineers help optimize your design for manufacturability while meeting your electrical requirements.
Wide selection of low-loss materials: Megtron 6/7, Isola I-Tera, Rogers 4000 series, and custom mixes. Dk range from 3.0 to 4.5 with controlled Df.
Our engineers simulate your stack-up using field solver software, optimizing layer thickness and trace geometry for your target impedance values.
Premium materials with certified Dk/Df values selected and tested. Consistent copper thickness and prepreg resin content verified before use.
LDI imaging for precise trace width. Etching compensation calibrated for each stack-up. Copper thickness monitored at every plating stage.
Test coupons measured with calibrated TDR equipment. Full impedance profile report delivered with your boards showing actual measured values.
Impedance control is essential for any design with high-speed signals, RF transmission, or sensitive analog circuits.
Share your stack-up requirements and we'll provide a detailed quote with impedance simulation results included free.
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