Fully RoHS-compliant PCB assembly using SAC305, SN100C, and other lead-free solder alloys. Complete environmental compliance for EU and global market access.
Industry-certified lead-free assembly with optimized reflow profiles, nitrogen atmosphere, and strict process control for superior solder joint reliability.
Sn96.5Ag3.0Cu0.5 — industry standard lead-free alloy. Excellent wettability, reliable solder joints, and proven long-term field performance across all applications.
Sn99.3Cu0.7Ni+Ge — lead-free with lower silver content. Superior drop-shock performance. Ideal for consumer electronics and mobile devices.
12-zone reflow ovens with nitrogen atmosphere (oxygen < 500ppm). Reduces oxidation and improves wetting for lead-free solder on complex pad geometries.
DATASensor real-time temperature profiling for every production run. Precise ramp-soak-spike profiles tuned for each board thickness and thermal mass.
Full support for halogen-free PCB materials (IPC 4101B). Low-halogen laminates with compatible lead-free reflow profiles for complete green compliance.
Complete CoC (Certificate of Conformity), IMS (Incoming Material Specification), and chemical composition reports for every lead-free order.
Our lead-free assembly processes meet all major international environmental regulations for market access worldwide.
BOM substance screening
Nitrogen reflow-compatible stencil
217°C peak, nitrogen atmosphere
Visual & X-ray solder joint check
Compliance certificate included
Sn96.5Ag3.0Cu0.5
Sn99.3Cu0.7Ni+Ge
Sn95.5Ag3.8Cu0.7
SAC-LT (179°C melt)
<500ppm O2 reflow
DATASensor monitoring
Certificate of Conformity
Halogen-free laminate
Upload your BOM, Gerbers, and compliance requirements. We provide full RoHS documentation and a competitive lead-free assembly quote within 24 hours.
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