High Density Interconnect PCBs with micro-vias, any-layer interconnects, and sequential lamination. Enabling miniaturization for smartphones, tablets, and wearable electronics.
HDI technology uses micro-vias and higher wiring density to reduce board size and improve electrical performance. Essential for modern compact electronics.
Mechanical drill through all layers. Larger pad sizes, higher parasitic inductance.
≥ 0.25mm drillLaser-drilled small vias, often in-pad. Reduced inductance and improved routing density.
0.05-0.15mm LIDAll layers interconnect with micro-vias. Maximum density, used in smartphones and IC substrates.
1+1+1, 2+2+2 StackAny-layer HDI with 8-12 layers of micro-vias. BGA fan-out, package-on-package (PoP), and ultra-thin profiles down to 0.4mm total thickness.
Ultra-thin flexible-rigid HDI combinations for smartwatches, AR glasses, and fitness trackers. Stacked micro-via technology for maximum density.
High-reliability HDI for implantable and portable medical devices. Biocompatible materials, strict IPC Class 3 standards, and mini-BGA packaging.
HDI PCBs for advanced driver assistance systems. Thermal management, vibration resistance, and miniaturized sensor modules with high-speed signals.
Micro-via ablation
Remove debris
Via copper fill
Sequential build-up
Electrical test
0.05mm (LID)
50μm / 50μm (2mil)
4-16 layers
1-3+ stacked micro-vias
0.4mm - 2.0mm
1+N+1, 2+N+2, Any-layer
IPC Class 2 & 3
99.5% pass rate
Upload your design files and stack-up requirements. Get a detailed HDI manufacturing quote.
Request Quote →