Precision laser-drilled microvias with multi-step lamination technology. Enable higher density interconnects for your most demanding HDI designs — from smartphones to aerospace systems.
Essential interconnect technologies for high-density interconnect (HDI) PCBs that maximize routing density while minimizing board size.
Vias that connect an outer layer to one or more inner layers without passing through the entire board. Laser-drilled for precision, they free up routing space on inner layers that would otherwise be blocked by through-hole vias.
Vias that connect inner layers only, completely invisible from the board surface. They eliminate via stubs, improve signal integrity, and allow more components and traces on outer layers.
Laser-drilled vias with diameters typically ≤0.15mm. Used in sequential lamination HDI builds (1+N+1, 2+N+2, 3+N+3 patterns) for ultra-high-density designs like smartphones and wearables.
Our advanced HDI manufacturing line delivers precision microvias with industry-leading reliability.
Dedicated HDI production line with state-of-the-art laser drilling and plating systems.
Dual-laser system for precise microvia formation. CO₂ laser for larger vias and UV laser for ultra-fine microvias down to 0.1mm diameter with clean, taper-free walls.
Proprietary copper plating process for reliable 100% via fill. Eliminates voids and air traps, ensuring excellent thermal and electrical conductivity through each via.
Optical alignment systems with ±0.05mm accuracy across multiple lamination cycles. X-ray inspection verifies inner-layer alignment for every HDI panel.
100% cross-section analysis on first articles. Thermal cycling, pull test, and shear test on filled vias to guarantee long-term reliability under demanding conditions.
Prototype HDI boards with blind/buried vias in as fast as 5 working days. Full DRC/DFM review included to optimize your design before fabrication.
Free HDI stack-up consultation and via structure optimization. Our engineers help you balance cost, density, and manufacturability for your specific application.
Inner core layers are fabricated with buried vias, copper plating, and etching. AOI inspection ensures trace quality.
UV/CO₂ laser drilling creates blind microvias in prepreg and copper foil with positional accuracy to ±0.025mm.
Electroless copper deposition followed by electroplating. Copper or epoxy resin fill eliminates voids in vias.
100% E-test, AOI, X-ray inspection, and cross-section verification. IPC-A-600 Class 2/3 acceptance.
HDI technology with blind and buried vias enables the miniaturization and performance demands of today's most advanced electronics.