Optimizing Signal Integrity in Multi-layer PCBs for High-Speed Data Transfer
Explore techniques for optimizing signal integrity in high-speed multi-layer PCBs, including controlled impedance, differential pair routing, and thermal management.
2024 年 7 月 22 日
Optimizing Thermal Management in High-Density PCB Layouts
Effective thermal management in high-density PCB layouts is crucial for performance and reliability. This article explores techniques like heat sinks, thermal vias, and thermal simulation.